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Over
35 years experience in electronics assembly innovation,
proposal generation and project management. Technical developments have
included copper wire bonding, laser processes, high temperature
electronics,
MEMS assembly, ruggedised displays and LED lighting. Has instigated and
managed
several Innovate UK/European projects, working collaboratively with
wide range
of industrial and academic partners. |
|
Over
35 years of experience in the Electronic Packaging Industry with skills
ranging from Assembly Manufacturing, Equipment selection and
validation, Lean Process Engineering, 5S, Technical Customer Support
and Product Development and Innovation. Supporting devices for the
Aerospace, Space, Medical and Smart Devices for the 'Internet of
Things'. Career also includes working on several collabrative projects
in the development of MEM's, SiP's and Additive Manufacturing Systems. |
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