Power Electronic Modules by Rapid Moulding.

Future aircraft will increasingly contain electrically powered system, including actuators, under-carriages, and the engines. The electronics needed to power and control them will use silicon carbide (SiC) devices which operate at higher temperatures than conventional silicon devices. Project PE2M will develop the technology and UK based supply chain to manufacture fully moulded SiC power modules using novel encapsulants. These cost effective encapsulants can withstand the high operating temperatures, enable efficient cooling of the devices and permit the materials to be recycled at the end of their operational lives.

End-to-End Supply Chain developement for Automotive Power Electronics

The Escape project was designed to establish a globally unique and cohesive end-to-end supply chain capability for innovative SiC power electronics designed to service UK and global end user demand. Tribus-D Ltd developed a cost effective, fully embedded, double side cooling power package that would be able to meet the automotive grade of qualifications.

Application of Copper Sintering Technologies to Manufacture of Intelligent Power Modules

Thermoplastic Encapsulated Embedded Power Modules

Assembly processes for the power electronics modules are critical for efficiency, size, weight and costs. This project will maximise thermal dissipation and minimise circuit parasitics through advanced interconnection and device encapsulation techniques.

Efficient Embedded Power Electronics module for Electric Vehicles (EV)

A feasibility study was conducted on the performance comparison between a power module manufactured using the new electronic packaging technology and embedded in a composite structure, to a module manufactured and packaged using conventional technology. The comparative assessment will include electrical performance, size and weight, and through-life costs.

Embedded Electronic Packaging Technologies for Compound Semiconductor Power Applications

This project was designed to investigate the use of die embedding techniques at package level rather than embedding in circuit boards. The module includes the integration of a power device, gate driver, diode and passive components in a single module.

Rapid Polymer to Metal Joints

Legislation is driving major changes in the way that certain industries designs and manufactures its products to make them more environmentally friendly and less polluting. In automotive, emissions controls are challenging designers to produce ever lighter vehicles, which has driven them to consider incorporating less dense materials such as polymer composites. In electronics, WEEE Legislation has driven designers to use materials, which are inherently recyclable as well as allowing them design freedom to reduce costs and increase functionality. This has led to a shift towards 3D packaging and the use of thermoplastic encapsulants. RapidPM will develop technology to enable structures comprising fundamentally different material types to be assembled rapidly, consistently and using low cost technology. The basic approach is to use a thermoplastic coating which is deposited onto the surface of one component, usually a metal such as aluminium alloy or copper, and bond this by welding onto the other component which could typically be a thermoplastic or a thermoplastic composite. In this way, designers of structures for the electronics and automotive industries can use the flexibility afforded by advanced thermoplastic processing technologies, the properties of the thermoplastic in use, and the inherent recyclability which thermoplastics bring by remelting. The project will generate results of mechanical test of joints, environmental tests, and techno-economic assessment against conventional adhesive bonding and mechanical fastening techniques.